Korean, Edit

Chapter 7. Diode

Recommended Article: 【Circuit Theory】 Circuit Theory Table of Contents


1. Semiconductor

2. Diode

3. Rectifier circuit

4. Actual rectifier


a. Diode Experiment



1. Semiconductor

⑴ Overview

① Faraday first reported semiconductors.

② Semiconductors have conductivity between conductors and insulators, which can be controlled by factors like temperature and purity.

⑵ Band Gap Theory

① Definition: Theory analyzing the potential energy for bound atoms rather than free particles

② Classification of energy bands

○ Energy band: A continuous range where states exist

○ Forbidden band gap: A continuous range where states don’t exist

○ Energy gap: Energy required to move an electron from valence band to conduction band

○ Energy bands further categorized into valence band and conduction band

③ Fermi level

○ Definition: The highest energy level electrons can have at 0 K

○ Fermi level defined this way leads to a half probability of electron occupancy at any temperature

○ Fermi-Dirac distribution: Probability of an energy level E being filled by particles at temperature T

○ Conductor: Fermi level located at the boundary of the valence band and conduction band

○ Insulator: Fermi level located in the middle of valence band and conduction band

○ Semiconductor: Fermi level located in the middle of valence band and conduction band


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④ Free electron (conduction electron)

○ Electrons that gain energy and become free to move after breaking shared bonds

○ Concentration of free electrons (n)


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⑤ Hole

○ A location where an electron was present but is now vacant

○ Concentration of holes (p)


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⑥ Size of energy gap determines electrical conductivity and resistance


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Figure 1. Energy bands of insulators, semiconductors, and conductors


○ Conductor: Valence band and conduction band overlap

○ Electrons capable of free movement between atoms at room temperature

○ Example 1: Silver’s resistance is ρ = 1.59 × 10-6 Ω·cm

○ Example 2: Copper’s resistance is ρ = 1.67 × 10-6 Ω·cm

○ Semiconductor: Narrow band gap

○ Example 1: Germanium’s resistance is ρ = 50 Ω·cm

○ Example 2: Silicon’s resistance is ρ = 250,000 Ω·cm. Energy gap is 1.12 eV

○ Insulator: Wide band gap

○ Example 1: Diamond’s resistance is ρ = 1012 Ω·cm

○ Example 2: Tungsten’s resistance is ρ = 9 × 1012 Ω·cm

⑶ Intrinsic Semiconductor

① Definition: Semiconductor made of pure crystals of elements like Si, Ge with 4 outer electrons

② Silicon crystal

○ Silicon unit cell is cubic. One side is 5.43 Å

○ Each silicon atom is neighbored by 4 silicon atoms

③ Temperature increase → Entropy increase → Generation of free electrons and holes

○ Number of free electrons = Number of holes

○ At 300 K, electron density in silicon ni = 1.5 × 1010 cm-3 (relatively low)

④ Resistance variation with temperature


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Figure 2. Resistance variation with temperature for conductors, semiconductors, and insulators[Note:2]


○ Conductor: Temperature increase → Increased atomic vibration → Increased resistance

○ Semiconductor: Temperature increase → Increased free electrons and holes → Reduced resistance

○ Insulator: Temperature increase → Electrons separate from atoms → Reduced resistance

○ In semiconductors and insulators, resistance reduction due to increased atomic vibration is greater than the effect of increased resistance, unlike conductors

○ Semiconductor components like computer parts show increased current due to temperature: Reason for needing cooling systems

⑤ Current flow in semiconductors

○ Type 1: Drift current: Movement of free electrons due to electric field in conductors


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○ μn: Electron mobility ≈ 1350 cm2/(V·s)

○ μp: Hole mobility ≈ 480 cm2/(V·s)

○ Viscosity unit is N·s/m2, similar to inverse mobility

○ Intrinsic semiconductor


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○ Drift current can saturate, so equation needs some modification


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Figure 3. Saturated drift current


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○ Type 2: Diffusion current: Current due to diffusion motion or convection motion of charge carriers


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○ Apply Fick’s Law of Diffusion inference

○ Einstein relationship


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⑷ Impurity Semiconductor


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Figure 4. Energy levels in impurity semiconductors

(가) is Intrinsic Semiconductor, (나) is N-type Semiconductor, (다) is P-type Semiconductor


① Doping: Adding impurities to intrinsic semiconductors to increase electrical conductivity

② P-type Semiconductor

○ Group 14 elements (Si, Ge) (4 valence electrons) + Group 13 elements (B, Al, Ga, In) (3 valence electrons)

○ Reaction equation: Na represents acceptor density


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○ Acceptor level created between conduction band and valence band, reducing band gap

○ Acceptor level is close to valence band

○ P-type semiconductors generally have electrons filled in acceptor levels

○ More holes in valence band than free electrons in conduction band, so current mainly due to holes


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③ N-type Semiconductor

○ Group 14 elements (Si, Ge) (4 valence electrons) + Group 15 elements (P, As, Sb) (5 valence electrons)

○ Reaction equation: Nd represents donor density


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○ Donor level created between conduction band and valence band, reducing band gap

○ Donor level is close to conduction band

○ More free electrons in conduction band than holes in valence band, so current mainly due to electrons


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④ Fermi level

○ P-type Semiconductor: Fermi level formed close to valence band due to acceptor levels

○ N-type Semiconductor: Fermi level formed close to conduction band due to donor levels

⑤ Charge numbers in impurity semiconductors

○ Similarity with equilibrium constant (a): Regarding electron density n, hole density p, energy gap Eg,


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○ Charge equilibrium equation (b)


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○ Number of holes (in P-type semiconductor): Simultaneous equations (a) and (b)


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○ Generally, concentration of majority carriers closely matches impurity density introduced

⑥ Process of creating impurity semiconductor devices

○ 1st. Melt silicon to a high temperature to form a highly pure liquid state

○ 2nd. Gradually cool while mixing small amounts of impurities

○ 3rd. Form a cylindrical crystal mass called an ingot

○ 4th. Form a thin wafer by thinly slicing the cross-section of the ingot

⑦ Example 1: ni = 1015 (1/cm3), Na = 1017 (1/cm3)


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⑧ Example 2: Electrical conductivity of silicon at room temperature


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⑨ Example 3: Electrical conductivity of p-type semiconductor with one indium-doped silicon atom among 107 silicon atoms at room temperature


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2. Diode

⑴ Definition: State where P-type and N-type semiconductors are joined. Permits current flow in only one direction

① Anode: P-type semiconductor region

② Cathode: N-type semiconductor region

③ Current flows only from anode to cathode direction: Doesn’t flow from cathode to anode

⑵ Equilibrium: State where no voltage is applied to PN junction

① Depletion region

Figure 5. Depletion region

○ Definition: Area near PN junction with no free electrons and holes

○ 1st. Electrons from N-type semiconductor move to P-type semiconductor due to diffusion force

○ 2nd. Recombination: Conduction band’s free electrons and valence band’s holes meet and annihilate

○ 3rd. Atoms lose electrons in N-type semiconductor form (+) pole, atoms gain electrons in P-type semiconductor form (-) pole

○ 4th. Electric field force forms: Additional movement of electrons inhibited by polarized atoms

○ 5th. Equilibrium reached when diffusion and electric field forces balance

② Built-in voltage

○ Electric field forms from N-type to P-type semiconductor → Potential difference occurs → Inhibition of electrons and holes moving towards N-type and P-type

○ Built-in voltage: Potential difference at equilibrium. Also known as potential barrier, contact potential, etc.

○ pn: Density of holes in N-type semiconductor

○ pp: Density of holes in P-type semiconductor

○ nn: Density of electrons in N-type semiconductor

○ np: Density of electrons in P-type semiconductor

○ Generally assumed to be 0.6 ~ 0.7 V in silicon diode problems

○ In equilibrium, carrier density with respect to distance from PN junction is assumed constant, unlike biasing

○ Equations such as pn(x) ≈ pn, np(x) ≈ np are valid.

○ To distinguish from bias, the carrier concentration in equilibrium is denoted as pn0, np0, etc.

③ Width of the depletion region

○ The wider the depletion region, the larger the built-in voltage: Reverse bias applies

⑶ Bias: State where voltage is applied to the PN junction

Figure 6. Bias

① Principle: Only contributes to current flow by minority carriers

○ Majority carriers do not significantly affect current flow

○ In P-type semiconductor, electrons diffuse to form current

○ In N-type semiconductor, holes diffuse to form current

② Forward Bias: Forward conducting state. Current allowed

○ Definition: State where the anode (P-type semiconductor) is connected to the positive terminal of the battery and the cathode (N-type semiconductor) is connected to the negative terminal of the battery

○ 1st. Understanding 1. Voltage applied in the direction of increased diffusion force: Electric field due to the potential barrier opposes the electric field due to the battery

○ Electric field due to the battery goes from (+) terminal to (-) terminal

○ Electric field due to charges goes from (+) charge to (-) charge

○ 1st. Understanding 2. Additional movement of electrons and holes to the depletion region narrows it

○ Battery voltage provides holes to P-type semiconductor → Holes move from P-type end to PN junction

○ Battery voltage provides electrons to N-type semiconductor → Electrons move from N-type end to PN junction

○ 2nd. Depletion region narrows, leading to excessive minority carriers – excess electrons and excess holes

○ 3rd. Excess electrons move to P-type semiconductor end. Excess holes move to N-type semiconductor end (estimated)

○ Concentration: Minority carrier concentration increases towards the junction

○ 4th. Diffusion current flows: Depletion region doesn’t hinder current flow

Figure 7. Concentration distribution in forward bias [Footnote: 6]

○ Dotted lines represent equilibrium concentration

○ Some figures indicate a gap equal to the width of the depletion layer at the junction

○ Current doesn’t always flow under forward bias; additional energy beyond the threshold barrier is needed

○ Formulation

③ Reverse Bias: Reverse blocking state. Current blocked

○ Definition: State where the anode (P-type semiconductor) is connected to the negative terminal of the battery and the cathode (N-type semiconductor) is connected to the positive terminal of the battery

○ 1st. Understanding 1. Voltage applied in the direction of decreased diffusion force: Electric field due to the potential barrier and electric field due to the battery are in the same direction

○ Electric field due to the battery goes from (+) terminal to (-) terminal

○ Electric field due to charges goes from (+) charge to (-) charge

○ 1st. Understanding 2. Additional movement of electrons and holes to the depletion region widens it

○ Circuit voltage provides electrons to P-type semiconductor

○ Circuit voltage provides holes to N-type semiconductor

○ Consequently, depletion region widens

○ 1st. Understanding 3. Battery voltage moves electrons to N-type end and holes to P-type end

○ 2nd. Depletion region widens

○ 3rd. Current doesn’t flow

○ Concentration: Fewer holes near the depletion region → Current doesn’t flow

Figure 8. Concentration distribution in reverse bias [Footnote: 7]

○ Dotted lines represent equilibrium concentration

○ Some figures indicate a gap equal to the width of the depletion layer at the junction

○ Formulation: IS is referred to as reverse saturation current

⑷ Diode Current-Voltage Characteristics

① Ideal diode

○ Formulation

○ Forward (P-type → N-type current) is like a zero-resistance wire (short)

○ Reverse (N-type → P-type current) blocks all current (open)

○ Generally, ideal diodes are represented as filled diodes

○ In practice, diodes are usually represented as empty diodes

② Real diode: Horizontal axis is diode voltage VD, vertical axis is diode current ID

Figure 9. Real diode current-voltage characteristics [Footnote: 8]

③ Threshold voltage (VF): Represented by VF

○ Definition: Voltage at which current flows but is small since it cannot overcome the potential barrier. Diode acts like a large resistance

○ Model 1. Based on the Fermi-Dirac distribution function

○ Actual diode characteristic curve is exponential

○ Useful to approximate this exponential function for two identical diodes in parallel connection

○ Thermal voltage is typically about 0.0253 V (25.3 mV)

○ Model 2. Piecewise Linear Model: Reflects only the threshold voltage, interprets the rest similar to an ideal diode

○ Generally, threshold voltage is about 0.6 to 1 V

○ Silicon junction threshold voltage: 0.7 V

○ Germanium junction threshold voltage: 0.3 V

○ Gallium arsenide junction threshold voltage (used in semiconductor lasers): 1.6 V

○ (Note) Threshold voltage and thermal voltage are unrelated

○ With current-voltage characteristics and threshold voltage, operating point can be determined

Figure 10. System of equations for current-voltage characteristics and piecewise linear model

(Example: V = 1, R = 1, a = 0.25, b = 1, vD = 0.5, iD = 0.4)

○ Equivalent circuit in threshold voltage problem

Figure 11. Equivalent circuit in threshold voltage problem

○ Current-voltage characteristics and threshold voltage characteristics are different terms

○ Model 3. Incremental method (small signal method): Diode can be treated as a single resistor for small changes in bias point (VD, ID)

Figure 12. Case where diode is approximated as a variable resistor

○ General formula

○ Example

④ Breakdown voltage

○ Definition: Maximum reverse voltage a diode can withstand

○ Avalanche breakdown

○ In practice, diodes have a very small leakage current (tens of mA) under reverse voltage

○ Reason: Electrons are present in P-type semiconductor and holes are present in N-type semiconductor as minority carriers

○ 1st. Electrons entering the depletion region gain sufficient kinetic energy due to the intensified electric field from the reverse bias

○ 2nd. These electrons separate electron-hole pairs in combined states

○ 3rd. Separated electrons initiate further chain reactions

○ 4th. Ultimately, the entire depletion region is neutralized → Current flows

○ A diode that undergoes avalanche breakdown is damaged

○ Even in the presence of a depletion region under forward bias, diode’s resistance effect appears: nonlinear

○ When avalanche breakdown occurs, the depletion region is eliminated, making the diode equivalent to a wire: piecewise linear

○ (Note) Junction destruction can be thought of as turning a diode into a reverse voltage source

○ Zener breakdown

○ Junction with heavily doped semiconductor → Increased diffusion → Reduced depletion region → Frequent quantum tunneling → Current flows

○ 1st. Electrons on the P-side valence band have higher energy than electrons on the N-side conduction band

○ 2nd. Adequate reverse voltage for direct movement results in current flow ( quantum tunneling )

⑤ Rated current

○ Definition: Maximum current a diode can allow to flow forward without being destroyed

○ Diodes must always be accompanied by a series-connected resistor for overcurrent protection

⑸ Special Diodes

① Zener Diode

○ Definition: Device utilizing the phenomenon where a constant voltage is formed when Zener breakdown occurs

Figure 13. Zener diode and Zener breakdown [Footnote: 9]

○ Under forward bias, the threshold voltage is constant, and the current-voltage characteristics are nonlinear

○ Under reverse bias, the breakdown voltage changes due to doping, and the current-voltage characteristics are piecewise linear

○ Zener diodes have high doping levels and have well-controlled breakdown voltages of 3 to 8 V

○ While breakdown durability of Zener diodes is enhanced, overcurrent still needs to be prevented

○ Example of voltage regulator circuit

○ Strategy: Assume Zener diode is absent

Figure 14. Example of voltage regulator circuit

○ For RL = 1.2 kΩ

○ For RL = 4 kΩ

② Light Emitting Diode (LED)

○ Under forward bias, carriers recombine near the junction, resulting in light emission

Figure 15. Principle of LED emission [Footnote: 10]

A is P-type semiconductor, and B is N-type semiconductor

○ (Note) N-type semiconductors have lower energy levels than P-type but have a higher conduction band

○ LED emits light corresponding to the band gap size

○ (Note) Most diodes convert energy to heat, not light

○ Silicon (Si) semiconductor, Germanium (Ge) semiconductor: Convert energy to heat, not light

○ Gallium arsenide (GaAs) semiconductor, Gallium phosphide (GaP) semiconductor: Emit light

○ High efficiency: Energy savings of up to 90% possible

③ Photodiode

○ Definition: Device that converts light energy into electrical energy by absorbing light energy

○ Similar Photovoltaic Effect

○ When light energy reaches the depletion region, electron-hole pairs are generated, resulting in current flow

○ In other words, electrons in P-type semiconductor transition to the conduction band of N-type semiconductor, simultaneously generating holes and free electrons

○ Functions as a sensor: Photocurrent depends only on the amount of light, independent of reverse bias voltage ( ∵ photocurrent is proportional to the number of electrons, which is proportional to the amount of light)

○ Reverse bias circuit

○ Meaning 1. To enhance light sensitivity, reverse bias is applied to increase the depletion region (raising the threshold)

○ Meaning 2. To prevent current flow in a solar charging battery when not under sunlight, connect the charging battery in reverse bias

○ (Note) Dark current: Current that flows without light exposure

○ Example 1. CD player, fire alarm, remote control receiver

○ Example 2. Solar Cells

Figure 16. Circuit of a solar cell

ⓐ: Direction of electrons, ⓑ: Direction of current, X is an n-type semiconductor

○ Example 3. Digital Camera Image Sensor (CCD)

Figure 17. Image sensor of a digital camera

○ Path of light: Lens → CCD → Converted to current signal → Detected light provides brightness, color, and coordinate information based on intensity and position

○ Must operate in visible light range, so threshold frequency should be lower than that of visible light

○ Example 4. Multi-channel Photodetector (Photodiode Array Spectrophotometer)

○ Measures dispersed light at different wavelengths simultaneously

○ Mainly uses an array of 1024 or 2048 silicon photodiodes

○ Advantages: Fast speed, excellent reproducibility, simultaneous measurement at multiple wavelengths

○ Disadvantages: Low resolution (1 ~ 3 nm) (0.1 nm possible for dispersive type), errors due to light source intensity and detector sensitivity

○ Used in real-time spectrophotometers

○ Example 5. pn Photodiode, pin Photodiode, Avalanche Photodiode, Phototransistor, PSD, 1D and 2D Arrays

⑹ Applications

① Crystal Radio Receiver (Cat’s Whisker): First commercialized diode circuit

② Light Emitting Diode (LED): CD players, fire alarms, remote control receivers, solar cells, CCD

③ Maximum output of input voltage

Figure 18. Maximum output of input voltage using diodes

④ Rectifier



3. Rectifier

⑴ Rectification: Process of converting AC voltage to DC voltage

⑵ Half-wave rectifier circuit

① Circuit Diagram

Figure 19. Half-wave rectifier circuit and load voltage curve for ideal diode

○ For forward bias, diode resistance is 0, so power supply voltage is directly transmitted to the load

○ For reverse bias, diode resistance is ∞, so power supply voltage is 0

② Actual diode

Figure 20. Half-wave rectifier circuit and load voltage curve for real diode

○ Real diode can be approximated as connected to a reverse-biased constant voltage similar to an ideal diode

○ Power supply voltage can be considered shifted downward by the reverse-biased voltage Vd

○ Load voltage can be considered as only the positive portion

② Half-wave rectifier circuit with capacitor

Figure 21. Half-wave rectifier circuit with capacitor circuit diagram

Figure 22. Half-wave rectifier circuit with capacitor

○ Segment 1. 0 ~ ¼ T

○ Capacitor charges quickly based on power supply voltage

○ Time constant is RC, so assumption is equivalent to assuming C is small

○ C = ∞ represents a short circuit, C = 0 represents an open circuit

○ In reality, capacitor voltage doesn’t follow power supply voltage perfectly as long as C is not zero

○ Segment 2. ¼ T ~

○ Capacitor discharges as power supply voltage is lower

○ Discharge follows an exponential curve, decreasing slower than power supply voltage

○ Larger load resistance leads to less discharge and flatter curve

○ Segment 3. ~ ¾ T

○ Rising capacitor voltage meets descending power supply voltage

○ After meeting, capacitor voltage starts rising along with power supply voltage

○ Segment 4. ¾ T ~

○ Power supply voltage decreases faster than capacitor voltage

○ Capacitor voltage starts to discharge and decreases following an exponential curve

○ Conclusion: Capacitor presence flattens voltage curve

⑶ Full-wave rectifier circuit

① Disadvantages of half-wave rectifier circuit

○ Half of the current is blocked in half-wave rectifier

○ Longer discharge time for capacitor in half-wave rectifier

② Full-wave rectifier: Utilizes all input energy

③ Type 1. Bridge full-wave rectifier circuit: Uses 4 diodes

○ Circuit diagram

Figure 23. Circuit diagram

○ Voltage drop is doubled compared to the circuit with ideal diodes

○ Adding a capacitor in parallel with the resistor yields smoother output than a half-wave rectifier

Figure 24. Load voltage of bridge full-wave rectifier circuit

④ Type 2. Center-tap full-wave rectifier circuit: Uses 2 diodes

○ Circuit diagram

Figure 25. Center-tap full-wave rectifier circuit diagram

○ Center-tap full-wave rectifier circuit with capacitor

Figure 26. Center-tap full-wave rectifier circuit with capacitor

⑷ Clipping circuit (Limiting circuit): Distribution of resistance and diode

① Definition: Circuit that clips the input voltage to not exceed a certain value

Figure 27. Clipping circuit

○ Case 1. VOUT < VBIAS + 0.7: VOUT = VIN ( ∵ Reverse bias)

○ Case 2. VOUT > VBIAS + 0.7: VOUT = VBIAS + 0.7 ( ∵ Forward bias)

○ Analyze cases for VOUT by reversing logical order

○ 0.7 V represents the threshold voltage

② Bidirectional simultaneous control is possible

Figure 28. Bidirectional simultaneous control of clipping circuit

○ Case 1. VOUT < -6 - 0.7: VOUT = -6 - 0.7 = -6.7

○ Case 2. -6 - 0.7 < VOUT < 4 + 0.7 **: **VOUT = VIN

○ Case 3. VOUT > 4 + 0.7: VOUT = 4.7

⑸ Clamping circuit: Distribution of capacitor and diode

① Definition: Circuit that shifts input signal waveform to a certain level without changing its shape

② Circuit diagram

Figure 29. Clamping circuit

○ Top left potential is input voltage, top right potential is output voltage

○ Assumption 1. R = ∞: Connecting a sufficiently large resistor in parallel with diode is practical for certain reasons

○ Assumption 2. Large C: Capacitor has a large time constant, voltage changes slowly. Functions like a secondary power supply

○ Interpret circuit based on equilibrium state

○ In equilibrium, capacitor is considered connected to a power supply corresponding to maximum voltage

○ Negative clamper: P-type semiconductor of diode is output potential, N-type semiconductor is grounded. This figure represents this case

○ Case 1 is only valid for points, not segments, making it distinct from Case 2

○ Case 1 is important because it derives VC and constant

○ All clamping circuits can be solved using case-based approach

○ Positive clamper: N-type semiconductor of diode is output potential, P-type semiconductor is grounded

○ Considering the scenario where diode is flipped in this figure: Input voltage remains the same

○ All clamping circuits can be solved using case-based approach

○ Clamping circuit operates as a clamping circuit for the input signal after the capacitor is fully charged


Figure 30. Capacitor charging status and clamping circuit

○ (Note) Implementing clamping circuit in practice is very challenging

⑹ Bridge rectifier: Uses a bridge circuit for rectification



4. Real Rectifiers



Input: 2018.01.27 08:55

Modification: 2022.09.11 20:22

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